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data sheet 3-pin microprocessor reset circuit az809a 1 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited general description the az809a is a precision system supervisor and reset circuit designed to monitor the power supplies in microprocessor and digital sy stem. it provides a reset signal to the host processor during power-up, power- down, and brownout conditions. the az809a has an active-low reset output, three standard reset options are offered to support 5v, 3.3v, and 3.0v system.whenever the system supply voltage declines below the internal fixed reset threshold, the az809a asserts a reset signal and the reset signal remains asserted for 240ms after v cc rises above the threshold. the az809a has a push-pull output, no external com- ponents are required. the output is guaranteed to be in the correct state at v cc level as low as 1v. the az809a is optimized to rej ect fast transient glitches on the vcc line. when the v cc is 3.3v, the supply current consumption is about 6 a typically. the ic is available in sot-23 package. features precise monitoring of 3.0v, 3.3v, and 5.0v sup- ply voltages 140ms minimum reset pulse width active-low reset output push-pull reset output no external components reset valid down to v cc =1.0v power supply fast transient immunity specified over full te mperature range: -40 to 105 o c applications microprocessor systems portable/battery-powered systems embedded controllers automotive intelligent instruments wireless communication systems pdas and handheld equipment set-top boxes adsl modems sot-23 figure 1. package type of az809a
data sheet 3-pin microprocessor reset circuit az809a 2 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited pin configuration (sot-23) n package 1 2 3 vcc gnd reset figure 2. pin configurati on of az809a (top view) pin description pin number pin name function 1 gnd ground pin 2 reset active low out put. the reset is asserted low if v cc falls below the reset threshold and remains low for the 240ms typical rese t timeout period ( 140ms minimum) after v cc exceeds the threshold 3 vcc power supply input volta ge (3.0v, 3.3v, 5.0v)
data sheet 3-pin microprocessor reset circuit az809a 3 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited functional block diagram vcc gnd reset figure 3. functional block diagram of az809a ordering information circuit type package e1: lead free az809a - tr: tape and reel n: sot-23 reset threshold: l: 4.63v s: 2.93v r: 2.63v package te mpe ra ture range reset threshold part number marking id packing type lead free green lead free green sot-23 -40 to 105 o c 4.63v az809anltr-e1 AZ809ANLTR-G1 eh7 gh7 tape & reel 2.93v az809anstr-e1 az809anstr-g1 eh1 gh1 2.63v az809anrtr-e1 az809anrtr-g1 eh6 gh6 reference voltage reset logic + timer oscillator 3 2 1 g1: green bcd semiconductor's pb-free products, as desi gnated with "e1" suffix in the part num ber, are rohs compliant. products with "g1" suffix are available in green package.
data sheet 3-pin microprocessor reset circuit az809a 4 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited parameter symbol min max unit supply voltage v cc 15.5v operating ambient temperature range t a -40 105 o c parameter symbol value unit supply voltage v cc -0.3 to 6 v reset -0.3 to v cc +0.3 v input current, vcc pin 20 ma output current, reset pin 20 ma rate of rise, v cc 100 v/ s continuous power dissipation 320 mw junction temperature t j 150 o c storage temperature t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c esd (human body model) 6000 v esd (machine model) 400 v absolute maximum ratings (note 1) note 1: stresses greater than thos e listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at th ese or any other conditions beyond those indicated under "recommended operating cond itions" is not implied. exposure to "absolute max- imum ratings" for extended periods may affect device reliability. recommended operating conditions
data sheet 3-pin microprocessor reset circuit az809a 5 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited (v cc is over the full voltage range, t a =-40 o c to 105 o c, unless otherwise noted. typical values at t a =25 o c, v cc =5v for l device, v cc =3.3v for s device and v cc =3v for r device.)(note 2) parameter symbol conditions min typ max unit input voltage (v cc ) range v cc t a =0 o c to 85 o c 1.0 5.5 v t a =-40 o c to 105 o c 1.2 5.5 supply current i cc l devices t a =-40 o c to 85 o c, v cc <5.5v 711 a t a =-40 o c to 105 o c, v cc <5.5v 12 r/s devices t a =-40 o c to 85 o c, v cc <3.6v 610 t a =-40 o c to 105 o c, v cc <3.6v 11 reset threshold v th l devices t a =25 o c 4.56 4.63 4.70 v t a =-40 o c to 85 o c 4.50 4.75 t a =-40 o c to 105 o c 4.40 4.86 s devices t a =25 o c 2.89 2.93 2.96 t a =-40 o c to 85 o c 2.85 3.00 t a =-40 o c to 105 o c 2.78 3.08 r devices t a =25 o c 2.59 2.63 2.66 t a =-40 o c to 85 o c 2.55 2.70 t a =-40 o c to 105 o c 2.50 2.76 reset threshold temperature coefficient t a =-40 o c to 105 o c 30 ppm/ o c vcc to reset delay v cc =v th to v th -100mv 20 s reset active timeout period t a =-40 o c to 85 o c 140 240 560 ms t a =-40 o c to 105 o c 100 840 low reset output voltage v ol r/s devices v cc =v th (min), i sink =1.2ma 0.3 v l devices v cc =v th (min), i sink =3.2ma 0.4 v cc >1.1v, i sink =50 a0.3 high reset output voltage v oh r/s devices v cc >v th (max), i source =500 a 0.8v cc v l devices v cc >v th (max), i source =800 a v cc - 1.5 electrical characteristics note 2. production testing done at t a =25 o c. over temperature specificati ons guaranteed by design only.
data sheet 3-pin microprocessor reset circuit az809a 6 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited typical performance characteristics figure 5. power-up reset timeout vs. temperature figure 6. power-down reset delay vs. temperature figure 7. normalized reset threshold vs. temperature figure 4. supply current vs. temperature -40.0 -20.0 0.0 20.0 40.0 60.0 80.0 100.0 120.0 0 1 2 3 4 5 6 7 8 9 10 11 12 v cc =5v v cc =3.3v v cc =1v supply current ( a) temperature ( o c) no load -40.0 -20.0 0.0 20.0 40.0 60.0 80.0 100.0 120.0 200 220 240 260 280 300 320 340 power-up reset timeout period (ms) temperature ( o c) -40.0 -20.0 0.0 20.0 40.0 60.0 80.0 100.0 120.0 0.997 0.998 0.999 1.000 1.001 1.002 1.003 1.004 normalized threshold temperature ( o c) -40.0 -20.0 0.0 20.0 40.0 60.0 80.0 100.0 120.0 0 20 40 60 80 100 120 140 160 180 200 220 240 v od =20mv v od =100mv v od =200mv v od =10mv v cc =v th to v th -v od power-down reset delay ( s) temperature ( o c)
data sheet 3-pin microprocessor reset circuit az809a 7 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited figure 8. maximum transie nt duration not causing typical performance ch aracteristics (continued) 10 100 1000 0 40 80 120 160 200 240 280 320 360 400 reset occurs above the curve l device maximum transient duration ( s) reset comparator overdrive v th -v cc (mv) 2 a reset pulse vs. reset comparator overdrive figure 9. maximum transient duration not causing a reset pulse vs. reset comparator overdrive figure 10. maximum transient duration not causing a reset pulse vs. reset comparator overdrive 10 100 1000 0 40 80 120 160 200 240 280 320 360 400 r device reset occurs above the curve maximum transient duration ( s) reset comparator overdrive v th -v cc (mv) 2 10 100 1000 0 40 80 120 160 200 240 280 320 360 400 reset occurs above the curve s device maximum transient duration ( s) reset comparator overdrive v th -v cc (mv) 2
data sheet 3-pin microprocessor reset circuit az809a 8 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited application information the az809a asserts a reset signal low whenever the vcc supply voltage is below the threshold voltage and remains asserted for 240ms typically after the vcc has risen above the threshold. operating diagram valid reset with v cc under 1.0 v the az809a reset output is valid to v cc =1.0v. below this voltage, the output becomes an open circuit and doesn't sink current. therefore, high-impedance cmos logic input connected to reset can drift to undetermined voltages. to ensure that the az809a reset is in a known state when v cc is under 1.0v, a 100k ? pull-down resistor between the reset pin and gnd is recommended to discharge stray capacitances and maintain the output low. vcc az809a reset gnd r1 100k ? figure 11. reset timing diagram of az809a figure 12. r eset valid to v cc =0v 240ms typical v th v cc 240ms typical time 20 s typical reset active timeout period output undefined reset time v cc (min)
data sheet 3-pin microprocessor reset circuit az809a 9 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited 10 100 1000 0 40 80 120 160 200 240 280 320 360 400 reset occurs above the curve maximum transient duration ( s) reset comparator overdrive v th -v cc (mv) 2 typical application figure 14. typical application of az809a application information (continued) negative going v cc transient the az809a is optimized to immune fast negative- going transients or glitches on the v cc line, and the sensitivity depends on the duration of the transient and the magnitude of the undershoot below the reset threshold (reset comparat or overdrive). figure 13 shows the maximum pulse width of a negative-going v cc transient that will not cau se a reset pulse. as the magnitude of the transient increases (goes farther below the reset threshold), the maximum allowable pulse width decreases. any combination of duration and overdrive that lies under the curve will not generate a reset signal, typically, a v cc transient that goes 100mv below the reset threshold and lasts about 20 s or less will not cause a reset pulse. a 0.1 f bypass capacitor mounte d as close as possible to the v cc pin will provide additional transient rejection. figure 13. maximum transient duration not causing a reset pulse vs. reset comparator overdrive vcc v th overdrive duration v cc vcc az809a reset gnd vcc reset microprocessor gnd
data sheet 3-pin microprocessor reset circuit az809a 10 oct. 2010 rev. 1. 3 bcd semiconductor manufacturing limited mechanical dimensions sot-23 unit: mm(inch) 2.300(0.091) 2.500(0.098) 1.200(0.047) 1.400(0.055) 0.920(0.036) 0.980(0.039) 0.390(0.015) 0.450(0.018) 1.900(0.075)ref 2.800(0.110) 3.000(0.118) 2.0 3.0 0.500(0.020) 0.700(0.028) 1.050(0.041)ref 0.020(0.001) 0.100(0.004) 0.900(0.035) 1.100(0.043) 4 r0.100(0.004) 7.0 7.0 0.550(0.022)ref 0.200(0.008)min 0.100(0.004) gauge plane 0.080(0.003) 0.150(0.006) r0.100(0.004) 0.0 ~ 10.0
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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